In semiconductors, a tantalum sputtering target is sputtered onto a semiconductor substrate using a physical vapor deposition (PVD) process. Such a process can form a thin film diffusion barrier to protect the copper interconnect. Tantalum sputtering targets are also used in a variety of other products. Tantalum sputtering targets are used in manufacturing including magnetic storage media, inkjet printer heads and flat panel displays. In addition, in terms of capacitors, the smaller the diameter of the tantalum wire, the more conducive to the development of smaller tantalum capacitors.
In the semiconductor manufacturing process, niobium material can be used to prepare metal niobium wires, niobium electrodes and niobium contact layers. Niobium's excellent electrical conductivity and stability make it one of the indispensable materials in semiconductor device manufacturing. As a high purity material, niobium has the characteristics of high purity and chemical stability. Therefore, the niobium sputtering target is very suitable for use in the magnetron sputtering coating. The niobium target can be combined with other materials to form a more versatile film material.
Titanium target is an important material, mainly used in the manufacture of semiconductors, optoelectronics and magnetic materials and other high-tech fields of materials. In the semiconductor industry, titanium targets can be used in the manufacture of electronic components, such as photodiodes, photodiodes, photoreceivers and transmitters.
Zirconium sheets can be used as substrate materials for semiconductor chips, providing mechanical support and stability.
Zirconium is also used as a surface treatment material for semiconductor chips, forming a zirconium oxide layer to enhance the wear resistance and chemical stability of the chip.
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