Niobium alloy sputtering target

In the sputtering deposition technique, the target material is used as the cathode material. Upon impact by a positively charged cation, the target material is removed from the cathode in the form of molecules, atoms or ions and redeposited on the surface of the anode.

Targets are widely used as thin film materials for sputtering cutting-edge technologies. Classified according to the application: semiconductor field with the target, recording media with the target, display film with the target, advanced touch screen and display, optical target and superconducting target.

Magnetron sputtering is one of the main techniques for preparing thin film materials. Magnetron sputtering uses an ion source to produce ions. The ions produced by sputtering are accelerated in the vacuum environment. The concentrated ions form an ion beam with high velocity energy. After bombarding the solid surface, kinetic energy is exchanged between ions and atoms on the solid surface. After being bombarded, the atoms on the solid surface will leave the solid surface and deposit on the matrix surface. The bombarded solids are the raw materials for deposition of thin films by sputtering. This raw material is the sputtering target.

Niobium alloy sputtering target is an important raw material for preparing niobium alloy thin films. Niobium alloy targets are widely used in optical coating, advanced touch screen and display and industrial decoration coating industries.

The internal grain size and surface roughness of niobium alloy sputtering target are very important. The grain size should be uniform in the axial direction.

Fortu Tech can produce niobium target, niobium plate, niobium wire, niobium foil, niobium processing workpiece according to customer requirements.