Analysis of process flow of vanadium target production
High-purity vanadium selection: The target material is manufactured using high-purity vanadium oxide, such as V2O5 (vanadium pentoxide), or metallic vanadium as the raw material. The purity must be ≥99.9% to meet the quality requirements for sputtering films. For alloy vanadium targets (e.g., nickel-vanadium targets), vanadium powder must be mixed with other metal powders (such as nickel or iron powder) according to the specified composition ratio and uniformly blended under an inert gas atmosphere.
Powder Processing and Forming
Powder Preparation: Oxide raw materials undergo ball milling, screening, and other processes to control particle size (typically 5-50μm). The material is then preformed into a loose billet using spray drying or cold isostatic pressing.
Cold Pressing: The mixed powder is compressed into a billet under a pressure of 200-300 MPa to achieve an initial dense structure with a density of approximately 60%-70%. For alloy targets, vacuum degassing is conducted after cold pressing to remove residual gas impurities.
Sintering and Densification
Hot Press Sintering: The billet is placed in a hot isostatic pressing (HIP) furnace and processed in two stages:
Low-Temperature Stage: Heated to 400-600℃ for 1-2 hours to promote initial particle bonding.
High-Temperature Stage: The temperature is increased to 750-900℃, and a pressure of 90-170 MPa is applied, maintaining these conditions for 3-6 hours to achieve a material density of over 95%.
Special Treatment for Pure Vanadium Targets: Metal vanadium targets are sintered in a vacuum or hydrogen atmosphere to prevent oxidation and enhance grain boundary strength.
Machining and Surface Treatment
Precision Machining: The sintered vanadium target is cut and polished using CNC machining to achieve the desired flat or tubular shape (e.g., a standard size of Φ200 mm × 5 mm).
Surface Polishing and Coating: The target surface undergoes acid pickling (using a mixed solution of nitric acid or hydrofluoric acid) to remove the oxide layer. Mechanical polishing is then performed to achieve a surface roughness of Ra ≤0.2 μm. For certain alloy targets, an anti-oxidation coating (e.g., nickel plating) may be applied to extend service life.
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